职位描述：
职责描述：
specific responsibilities include:
• lead new product and product variant designs
负责新产品和产品转型设计
• bring designs through qualification, customer acceptance, release, and profitability by troubleshooting problems and improving yield
负责通过资格认证，客户接受和发布来实现设计，通过排除问题和提高产量来实现盈利
• work cross functionally across the organization to chips, optical, electrical, packaging, rf, and control loop design elements
负责在芯片，光学，电气，封装，研发和控制回路设计元素中实现跨功能工作
• generate internal requirements from customer specifications and interactions
负责与客户沟通，根据客户要求生成内部要求
任职要求：
requirements and experience:
• master. degree or equivalent in electronic engineering/physics/optical communications or similar discipline
硕士及以上学历，电子工程、物理、光学通信或类似学科的学位或同等学历
• 5 plus years in optoelectronics industrial experience, preferably with package design
5年以上光电子行业经验，熟悉封装设计的优先
• excellent communication skills and experience working with customer engineers
有着很好的与客户经理沟通技巧和经验
• wide technical knowledge including chip devices, rf devices, optoelectronics packaging, electronics, control loops, rf design, optical design, and mechanical design
有着广泛的技术知识，包括芯片器件，射频器件，光电子封装，电子器件，控制回路，射频设计，光学设计和机械设计等