职位描述：
职责描述：
specific responsibilities include:
• guarantee the key process for normal operation of production line
保证生产线关键流程的正常运行
• maintain a daily management system that includes making visible daily yield，process parameters and variations, defect modes and equipment status and enable preventive improvements to address problems
维护日常管理系统，包括提供可见的日产量，工艺参数和变化，缺陷模式和设备状态，并实现预防性改进
• develop detailed process instructions for package processes, equipment verification,technician training etc.
制定包装流程，设备验证，技术人员培训等详细流程说明
• drive the process cost reduction and quality/uph improvements
持续优化成本，提升工艺质量和效率
• support r&d engineer for building prototype samples
协助研发工程师制作工程样品
任职要求：
• bachelor degree or equivalent in mechanical engineering /automation or similar discipline
机械工程/自动化或类似学科的学士学位或同等学历
• 3 plus years in in process development
3年以上的工艺开发经验
• should have experience in semiconductor packaging technique, such as die bonding and wire bonding etc.
具备半导体封装技术方面的经验，如芯片键合、引线键合等。
• good knowledge of semiconductor assembly equipment
熟悉半导体工艺设备